Bluetooth PCBA Service Development Manufactures Pcba Assembly

Bluetooth PCBA Service Development Manufactures Pcba Assembly OEM/ODM Services: Layers 1-22 layersMin. line width2milMax.board size (single&doule 700*1200mmMin.annular ring width: vias3milsided)

Bluetooth PCBA Service Development Manufactures Pcba Assembly 

OEM/ODM Services:  

Layers 1-22 layers Min. line width 2mil

Max.board size (single&doule 700*1200mm Min.annular ring width: vias 3mil


Surface finish HAL(with Pb free),plated Ni/Au, Min.board thickness(multilayer) 4layers:0.4mm;

Immersion silver,Imm Ni/Au,Imm Sn, 6layers:0.6mm;

hard gold,OSP,ect 8layers:1mm;


Board materials FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, Plating thickness (Technique: Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''

PTFE,nelcon, Immersion Ni/Au)

ISOLA,polyclad 370 HR); thick copper  

Impedance control ± 10% Distance between Outline: 0.2mm V-CUT: 0.4mm

line to board edge

Base copper thickness(Inner Min. thickness:1/3 OZ Max.thickness:6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16

and outer layer)

Finished copper thickness Outer layers: Max.board thickness(single&doule sided) 6mm

Min.thickness 1 OZ,

Max.thickness 10 OZ

Inner layers: 

Min.thickness 0.5OZ,

Max.thickness 6 OZ